The City is installing a roundabout to address safety concerns at the intersection. This project will replace the large intersection and its four-way stop signs with a roundabout in an effort to enhance safety for people crossing Printers Parkway at this intersection.
The current configuration requires travelers to stop in the middle of the intersection paralleling a wide median before crossing the road or turning onto Printers Parkway. This has consistently rated as a high-accident intersection among City-owned roads in Colorado Springs. Due to the wide median and right-of-way footprint of the intersection, City Engineering staff believe the best solution is a roundabout.
The intersection of Printers Parkway and South Parkside Drive.
- The City was awarded a grant from the Federal Hazard Elimination System (HES) in the amount of $561,433 to construct this project. The City of Colorado Springs will contribute a Local Agency Match of $62,382.
- The roundabout will have a single lane. Through lanes on Printers Parkway will be reduced from two lanes to one just before the roundabout.
- City Engineering selected Jacobs Engineering to design the project. A construction company will be selected in summer 2019.
- Roundabouts have proven to have less severe crashes and, in this case, should reduce all front to side crashes. Roundabouts also present a constant-flow option to allow for traffic movemCopyents without delays when compared to other intersection options.
Construction is anticipated to begin in the summer of 2019. Click here to be added to the project email list.
Kevin Diekelman, firstname.lastname@example.org
Public Open House to View Construction Plans
A public open house took place April 23, 2019 at which the public could view the proposed intersection and construction plans. Engineers from the project team and the City of Colorado Springs were on-hand to answer questions and to solicit information about local traffic patterns that may be valuable in developing construction detours and phasing plans. Presentation materials are below: